Solvent-free low linear expansion adhesive NICBOND NB3004
Solvent-free low expansion adhesive
This product is an adhesive that suppresses the coefficient of linear expansion to a level comparable to that of metals. The resulting cured material exhibits high adhesion and heat resistance. Despite being solvent-free, it achieves both a low coefficient of linear expansion and low viscosity. Since its coefficient of linear expansion is similar to that of metals, the risk of delamination issues is significantly reduced.
- Company：DAIZO NICHIMOLY
- Price：Other
